T870a Bga Irda Welder Infrared Heating Rework Station

BGA IRDA Welder Infrared Heating Rework Station T870A

Features:
1, the machine using self-developed infrared heating devices, the international advanced welding technology, infrared demolition.
2, special infrared heat, penetrating power, the device heat evenly, breaking the traditional hot air welding machine covering the demolition component heating, thermal shock greater disadvantage.
3, easy, after a day of training can fully operate the machine.
4, no demolition welding jig, the machine removable welding 35-50mm all the components.
5, this machine is equipped with 800W preheated sol system, preheat the scope of 240x180mm.
6, Infrared heating no hot air flow will not affect the peripheral micro-components, removable welding or repairing BGA, SMD, CSP, LGA, QFP, PLCC and BGA ball placement, especially BGA, SMD components. At the same time you can rework and the needle of a variety of power strip outlets (such as the CPU socket and GAP inserted row).
7, is fully capable to meet the computer, laptop, electric tours BGA desoldering / rework requirements. Particularly suited to the computer north and south bridge's.

Technic parameter

Instrument inventory

1, boot and boot before the examination:
①, check the infrared light before boot body, the temperature sensor and the power cord is connected.
②, turn the power switch. And other self-test by then using (panel screen displayed when you last used settings).
③, front panel has two switches, namely, control of PCB board preheat, infra-red lamp body of work; pressing the front panel "IR PRE-HEAT PIATE" of the "▲" "▼", can be 60-200 ℃, the regulator PCB board preheat temperature, pressing the switch to "ON", then the preheating chassis to work, pressing the switch to "OFF", then the preheating chassis to stop working; pressing the front panel "IR HEAT LAMP" of the "▲" " ▼ ", can be 200-350 ℃, the regulating body temperature infrared lamp, pressing the switch to" ON ", then the infrared lamp body to work, pressing the switch to" OFF ", then the infrared lamp body to stop working.
2, the dissolution of solder / rework operations:
①, PCB board placement:
The PCB board will be selected alignment notch on the pallet, placed in the bracket on the PCB board, PCB board fastening splints hand wheel, and fixed the PCB board; move around pallets sliding frame, select the appropriate job placement.
②, demolition welding / repairing pre-adjustment and preparation work:
Regulator PCB board, and make the required desoldering / rework the vertical alignment of the chip center spot infrared light body centers; adjust the lamp body height, to maintain lamp with the demolition welding object height is 20-30mm is appropriate;
Adjust the height of infrared lamp temperature sensor to prevent chip or chip right next to the appropriate location, in the chip and sensors around the head coated with flux (soldering or welding Po oil), it would allow the sensor measured the temperature more accurately, while the role of a flux to help solder, BGA pad will be more intact, can effectively prevent the pad from being sticky, and since tin hair and so on.
When the chips are coated with waterproof solid sealing glue, we must first open the infrared preheating chassis melt glue, so that the heat softened plastic or powder, the first clean off; also use other measures such as sol-hydrosol. In accordance with the supplied sol temperature for sol processing, plastic melting temperature should not be too high, usually 120-140 ℃ suitable preheating time for 3-5 minutes or longer.
③, desoldering / rework process:
Process based on product requirements or the size of the PCB board to regulate the PCB board preheat temperature (60-200 ℃ adjustable), you can open the preheating chassis in advance, generally 3-5 minutes, preheating chassis will stabilize at pre-set temperature context;
According to the chip size and welding process requirements, select the appropriate infrared lamp heating temperature (200-350 ℃ adjustable), can meet the desoldering / rework process requirements can be.
General experience: According to the desoldering / rework chip size, proper adjustment of the output of infrared lamp temperature (200-350 ℃ adjustable) and the PCB board preheat temperature (60-200 ℃ adjustable);
First preheat to 100-120 degrees is appropriate;
Demolition of more than 30x30mm chip, in accordance with processes and user experience, adjustable infrared light to about 240-260 ℃, preheating chassis PCB plate temperature to 120-140 ℃, the first 3-5 minutes to preheat, and so the chassis stable at pre - After the temperature can be easily completed desoldering / rework process;
Infrared heat lamp can be stepless adjustment, based on your choice of chips the size of free adjustment, when adjusted to the maximum, the strongest infrared light, the chip heat up faster, pay special attention to control and prevent displacement sensors, temperature measurement are not allowed, chip heating time too long, too high temperature, heat a bad chip.
Demolition operation process is generally as follows: Fixed PCB board, PCB board to adjust the position, adjust the center of infrared lamp is being demolished for the chip to adjust the height of infrared light, infrared lights placed temperature sensor, Tu flux, set preheating chassis preheat temperature and the infrared lamp operating temperature, open the preheating chassis 3-5 minutes or longer after point, pre-heating temperature set value in the vicinity of a stable, open-infrared light heating chip, to achieve pre-set temperature or chip tin plate melting, vacuum suction pen or tweezers remove the chip, turn off infrared light and preheat plate switches, such as the host fully cooled, turn off the power.
Reflow operation process is generally as follows: the basic operation with the demolition process. The difference is: the first clean-up pad and the solder ball plant, preheating PCB board, the correct placement of chips, according to solder ball reflow process temperature preheat, reflow soldering, cooling.
For the Pb-free devices can be further increased temperature of 20-30 ℃ can be.
④, demolition welding / repairing a variety of articles and the needle outlet power strip (such as the CPU socket and GAP inserted row):
Normal operation as follows: first to tear down and welded parts of the PCB board Heat intolerance and non-demolition welding with aluminum foil covering the device, and then soldering the PCB board to tear down and fixed to the PCB board bracket, the fixed-good, pre-board PCB preheating the temperature to 160-180 ℃, the temperature sensor placed in the demolition welding device side, open the preheating chassis 3-5 minutes or longer through the point, after the demolition welding device is heated evenly, generally desoldering. Can be opened at the top of a special infrared lights as heating, welding devices can be quickly dismantled.
For the Pb-free devices can be further increased temperature of 20-30 ℃ can be.
For the pairs of panels, you can use a lower preheat temperature before preheating PCB board, then heat can be supplemented at the top.
⑤, desoldering / rework process and the related Notes Note:
Demolition welding / repairing relatively large PCB board chip, such as: computer board, we must fully carry out the entire board preheating dry treatment process in accordance with the requirements provided by the manufacturer, but also their experience processing; only handled properly, can be effectively prevent the demolition solder / rework chip, PCB board distortion and the resulting cold solder joint, chip Qiaojiao.
For the simple chip package, the proposed central part of the chip (silicon position) Pre-affixed aluminum foil to prevent overheating burst silicon. Aluminum foil paper size is slightly larger than silicon as well, do not too much will affect the chip bonding effect.
Desoldering / rework process, the infrared light irradiation of the region, all of the plastic plug-ins, applications cover the aluminum foil to prevent the high-temperature infrared drying deformation or damage. But not all parcels.
Reflow / rework End of the PCB board, and so cooling, cleaning, drying was conducted after the test; if not, can once again return to welding. If there is not repeat the whole process.
Before and after work, in the absence put PCB board according to circumstances, can not be a long time to open infrared light, will reduce the lamp life; prohibited prolonged exposure to infrared light reflecting highly reflective objects, will seriously affect the lamp life.
3, maintenance and overhaul:
①, the maintenance of whole machine: the machine used for a period of time, on the focusing frame, guide pillar, PCB board sliding parts such as a stent, regular cleaning with grease to keep the purpose of lubricants and rust.
②, preheating chassis and infrared lamp body maintenance: preheating chassis and infrared lamp body, especially the infrared light of high permeability protective slide, on a regular basis with anhydrous alcohol wipe to remove flux condensate to maintain the infra-red heat rate injective smooth.
③, infrared lamp replacement: replacement of infrared lamps, using special calipers or long within the mouth beak pliers, slide the spring fixed within the first card, slide, spring inside the card once removed; then remove the fixed infrared lamp spring inside the card, then use the bamboo stick or a wooden barrel in the light vents outside the Department, gently push-out infrared light, unplug the lamp holder to replace the new infrared light; by reverse order can be re-loaded.
Note:
1, after work, do not immediately off the power, so that the full cooling fan light body, to extend the service life.
2, maintaining smooth flow of air vents, light body clean. Clean regularly with anhydrous alcohol lamp slide!
3, guide columns, focusing stent timely wipe with oil to maintain lubrication.
4, be careful, high-temperature operation, pay attention to safety.
5, long-term non-use, should unplug the power plug!